http://rdf.ncbi.nlm.nih.gov/pubchem/patent/FR-2674861-A1

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36c7e6417df7d3a93390112f3b4a70b5
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C48-397
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C48-405
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
filingDate 1991-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f9c8fb7b9deddd013e9e904c3d1133b6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_db8ce7fb7521a1d692b7b7e234d4e291
publicationDate 1992-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber FR-2674861-A1
titleOfInvention THERMOSETTING MOLDING COMPOSITIONS OBTAINED FROM A REACTIVE THERMOPLASTIC POLY (IMIDE-AMIDE) OLIGOMER AND A PHENOLIC POLYCONDENSATE CO-REACTIVE.
abstract The present invention relates to thermosetting compositions which comprise the reaction product, at a temperature ranging from 200 ° C to 300 ° C, between the following reactants A and B: A represents at least one end-functionalized thermoplastic poly (imide-amide) oligomer chains by a maleimido or nadimido group; B represents a coreactant chosen from: B1 = a novolak resin or B2 = a mixture of B1 with a non-halogenated epoxy resin and / or an alkenylphenol compound. Said thermosetting compositions are used for making objects shaped by the technique of injection or compression molding.
priorityDate 1991-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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