http://rdf.ncbi.nlm.nih.gov/pubchem/patent/FR-2621052-A1

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filingDate 1987-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_753b0b84e589caf594eb1280c9834342
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publicationDate 1989-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber FR-2621052-A1
titleOfInvention BATHS AND METHOD FOR CHEMICAL POLISHING OF COPPER SURFACES OR COPPER ALLOYS
abstract Baths for the chemical polishing of copper or copper alloy surfaces, comprising, in aqueous solution, hydrogen peroxide, chloride ions, phosphoric acid and phosphate and hydrogen phosphate salts in controlled amounts to give the bath a pH between 1.25 and 3.
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