| abstract |
The invention relates to curable mixtures based on epoxy resins. They contain: a) 10 to 80 parts (by weight) of an epoxy resin having a functionality of at least 3, b) 90 to 20 parts of an epoxy resin having a functionality of 2 to 2.5, c) a diphenol consisting of 0 to 80% of a compound of formula I or II: (CF DRAWING IN BOPI) (T denotes a direct bond, a methylene, an isopropylidene, O, S, CO or SO2 and R l ' hydrogen or alkyl), and from 100 to 20% of a dihydroxy-naphthalene, and d) from 0.05 to 5%, based on resins a and b, of an accelerator. These mixtures, which are not very viscous and keep well, are suitable for the manufacture of prepregs and adhesive films. |