abstract |
THE INVENTION RELATES TO A SEMICONDUCTOR DEVICE. IN THIS SEMICONDUCTOR DEVICE CONTAINING A COPPER LINK WIRE 6 ELECTRICALLY CONNECTING A WIRE 1 TO A CONNECTING PLOT 5 WHICH IS FORMED ON A SEMI-CONDUCTIVE PAD 3, A BALL-SHAPED PART 6A SHAPED AT THE END OF THE WIRE 6 ON THE SIDE OF THE DIT LINK PLOT 5 HAS A VICKERS MICRODURITY LESS THAN 65. APPLICATION IN PARTICULAR TO SEMICONDUCTOR DEVICES CONNECTED TO WIRES AND SEALED HERMETICALLY IN A RESIN. |