| abstract |
1419163 Microcircuit assemblies INTERNATIONAL BUSINESS MACHINES CORP 13 April 1973 [31 May 1972] 17806/73 Heading H1K An electronic circuit assembly comprises a microcircuit chip bonded to a substrate using an adhesive comprising an epoxy resin (I), a stoichiometric amount of an aromatic diamine curing agent (II) and 50-80% by wt. of the composition of alumina, silica or zirconium orthosilicate of particle size 6-12 Á. I may be a diglycidyl ether of bisphenol A or an epoxy novolac resin. II may comprise 55-75% mphenylenediamine and 45-25% methylenedianiline. In examples silicon chips are bonded to novolac, copper and aluminium substrates. |