| abstract |
PROCEDURE TO TREAT A RESINOUS SUBSTRATE WITH A VIEW TO ITS SUBSEQUENT METALLIZATION. IT INCLUDES THE OPERATIONS OF CONTACTING THE SUBSTRATE WITH AN ALKALINE AND AQUEOUS LIQUID SOLUTION INCLUDING WATER, ALKALINE METAL HYDROXIDE, SUCH AS NAOH, KOH / CSOH, RBOH OR THEIR MIXTURES AND MNO4; TO RINSE THOROUGHLY THE SUBSTRATE TREATED WITH SAID AQUEOUS ALKALINE SOLUTION; AND TO APPLY TO THE RINSED SUBSTRATE AN ACID NEUTRALIZATION SOLUTION, SUCH AS DILUTED SULFURIC ACID, TO SUBSTANTIALLY REMOVE THE TOTALITY OF MANGANESE RESIDUES FROM THE SURFACE OF SAID SUBSTRATE. THE ALKALINE METAL HYDROXIDE MUST BE PRESENT IN SUCH AQUEOUS SOLUTION IN AN AMOUNT THAT PROVIDES APPROXIMATELY 1 TO 4 MOLES OF OHC PER LITER OF SOLUTION. FOR APPLICATION ON PRINTED CIRCUIT BOARDS. |