http://rdf.ncbi.nlm.nih.gov/pubchem/patent/ES-392679-A1

Outgoing Links

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6d71db00fdff8c774036fc4dee79dcfa
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-48
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-48
filingDate 1971-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 1974-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber ES-392679-A1
titleOfInvention PROCEDURE FOR THE DEPOSITION OF UNIFORM GOLD PLATED.
abstract Procedure for the deposition of uniform gold plating, characterized in that it comprises electrolyzing a cyanide-gold plating electrolytic solution containing a gold cyanide complex, from 1 to 140 mg of thallium per liter of solution and sufficient conductive materials and buffer effect to provide a pH in said solution of at least 6.5. (Machine-translation by Google Translate, not legally binding)
priorityDate 1970-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 18.