| abstract |
A halogen-free thermoset resin composition, based on 100 parts by weight of organic solids, comprising the following components: (A) 30 to 60 parts by weight of a halogen-free epoxy resin, (B) 10 to 35 parts by weight of a phenolic curing agent, and (C) a phosphorus-containing flame retardant; wherein the halogen-free epoxy resin comprises the epoxy resin having the structure of formula (a) ** (See formula) ** wherein T1 and T2 are each independently selected from the group consisting of a hydrogen atom, the structure of formula (I) or (IIn); n1 and n3 represent the number of repeated units and each is independently an integer greater than or equal to 1; n2 represents the number of a repeating unit and is an integer greater than or equal to 0; ** (See formula) ** where n4 represents the number of a repeating unit and is an integer greater than or equal to 1; ** (See formula) ** where Tn and Tn 'are each independently selected from the group consisting of a hydrogen atom, the structure of formula (I) or (IIn + 1) and are terminated with a hydrogen atom or the structure of formula (I); n is a positive integer greater than or equal to 3; n5 and n6 represent the number of repeated units and each is independently an integer greater than or equal to 0; n7 represents the number of a repeating unit and is an integer greater than or equal to 1; the epoxy resin having the structure of formula (a) has a molecular weight of 1000-20000; the epoxy resin having the structure of formula (a) is in an amount of 50% by weight or more of the halogen-free epoxy resin. |