Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_155fe9ddb9ab032b64ca7df5005555c0 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E10-547 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-011 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-02167 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-068 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-126 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-00 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-068 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-0216 |
filingDate |
2014-03-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2019-11-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2535afe41bf8f905ce153fea82c23f32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b4ae9da19e43b879a8e7fa868c23683e |
publicationDate |
2019-11-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
ES-2731904-T3 |
titleOfInvention |
Copper cladding method for solar cell manufacturing |
abstract |
A method of plating copper on a substrate comprising: providing a substrate, wherein the substrate is a metallic seed layer on a silicon solar cell wafer comprising an aluminum back; and contacting the substrate with a copper plating solution comprising a source of copper ions and a conductivity salt of lithium sulfate wherein the copper plating solution has a pH between 1.7 and 3.5 and is free of chloride ions and where the back of the silicon solar cell wafer is not affected by the coating solution. |
priorityDate |
2013-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |