| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5e55f05ee42af3b6158070605ead8705 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1536
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09309
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-061
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49155
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0394
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-386
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0733
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49165
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1461
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-423
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-096
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0191
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4069
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0271
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0502 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4614
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-462
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4617
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4623 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-20 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate |
2007-04-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2019-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3b9e7d50c3958be47d0aaf7057e0bab0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f98a6bc2c2523b56fb1229bb29796458
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_625db0916a4aebaff93deff2a855e7f4 |
| publicationDate |
2019-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
ES-2703245-T3 |
| titleOfInvention |
Method of manufacturing printed circuit boards with stacked microcars |
| abstract |
A method for manufacturing a printed circuit board (80) having a plurality of circuit layers (L1-L8) with at least one z-axis interconnection using a single rolling cycle, the method comprising: joining together a plurality of carriers of a layer of a metal (70) after the parallel processing of each of the plurality of carriers of a layer of a metal (70), wherein the parallel processing of at least one of the plurality of carriers of a layer of a metal (70) comprises: - forming images of at least one photoresist (20) on a substrate (10) having at least one copper foil (10a) formed on at least one side of the substrate (10); - engraving the at least one copper foil (10a) of the substrate (10) with the exception of at least a part of the at least one copper foil (10a) covered by the at least one photoresist (20); - detaching the at least one photoresist (20) to expose the at least one part of the at least one copper foil (10a) to form at least one copper foil pad (11) for one of the plurality of circuit layers (L1 - L8); - after the peeling step, apply a laminating adhesive (30) on the substrate (10); - applying a protective film (40) on the laminating adhesive (30); - after the step of applying a protective film (40), drilling at least one micro-track (50) through the protective film (40), the laminating adhesive (30) and the substrate (10) on one side of the substrate (10) opposite the at least one side of the substrate (10) to expose at least one copper foil pad (11); - filling at least one conductive paste (60) in the at least one micro-track (50) formed in the substrate (10); and - removing the protective film (40) to expose the laminating adhesive (30) on the substrate (10) for its attachment; and wherein the conductive paste (60) and the laminating adhesive (30) are cured in the individual rolling cycle. |
| priorityDate |
2006-04-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |