http://rdf.ncbi.nlm.nih.gov/pubchem/patent/ES-2630371-T3
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4bbe0c235c848175f1f3f0b770e7f6f9 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24355 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4867 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49844 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1216 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0306 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22F1-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-22 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 |
| filingDate | 2014-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2017-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_13c92317524a23c0f34694bcd559d541 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1126ad52432ab64cb4435700458744d8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6e76b69c159d97af522a8c15fcbbab8a |
| publicationDate | 2017-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | ES-2630371-T3 |
| titleOfInvention | Multi-level metallization on a ceramic substrate |
| abstract | Procedure for the preparation of a multilevel copper metallization on a ceramic substrate (4) of AlN or Al2O3, by means of which high performance areas (1) are created on the same ceramic substrate (4) with metallizations with greater capacity of electric current charging and low-performance areas (2) with metallizations with lower electric current charging capacity, characterized by the following procedural steps, which must be performed successively: a) printing a joint base metallization for the high-performance area (1) and the low performance area (2) of a copper base paste containing glass by screen printing or pad printing with a thickness of 20 to 50 μm, b) reinforcement of the base metallization in the high performance areas (1 ) by means of repeated or multiple printing of a copper reinforcement paste without proportion of glass on the base metallization by means of screen printing or printing with pla nillas up to a total thickness of copper from 300 to 500 μm, c) cooked from the metallized ceramic substrate (4) with high performance areas (1) and low performance areas (2) together at 850 to 950 ° C in nitrogen, d) mechanical leveling of high performance areas (1) for the creation of a flat surface with a roughness Rz <5 μm. |
| priorityDate | 2013-02-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 26.