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filingDate 2014-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2017-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1e6e3d2eb960ac4637cd5e4e45befc0c
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publicationDate 2017-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber ES-2571177-B1
titleOfInvention Negative photosensitive resin for direct writing of structures
abstract Photosensitive negative resin for direct writing of structures. # The present invention relates to a photosensitive negative resin of transition metal oxides comprising an organic content less than or equal to 20% by weight with respect to the total weight of the resin, an inorganic content auxiliary to the nominal less than or equal to 0.01% by weight with respect to the total weight of the resin and having a refractive index from about 1.8 to about 2.4. The invention also relates to transition metal oxide structures obtained by direct writing on the resin of the invention, as well as the method of preparation of the resin of the invention, the method of direct writing of the structures of the invention and uses of both resin and structures.
priorityDate 2014-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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