| abstract |
A circuit board assembly (160) comprising: a circuit board (161) having an outer surface; the outer surface being configured with a plurality of discrete electrical components (164, 170) that are independently manufactured from each other. a first protective dielectric layer (150) superimposed on the outer surface and characterized by a second dielectric layer (158) superimposing the first layer Protective dielectric (150) and the plurality of discrete electrical components (164,170), the second dielectric layer (158) comprises a dielectric material with a modulus of elasticity less than 3.5 Giga-Pascals (GPa), a dielectric constant less than 3.0, an electrical loss less than 0.008, a moisture absorption less than 0.04 percent, a perforation voltage resistance of more than 2 million volts / centimeter (MV / cm), a temperature stability at 300ยบ Celsius, free of pores in films of more than 50 Angstroms, hydrophobic with a humidification angle greater than 45 degrees, capable of being deposited conformalmen you over and under 3D structures with a uniform thickness less than or equal to 30%. |