http://rdf.ncbi.nlm.nih.gov/pubchem/patent/ES-2415879-T3
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f6d13b587d21aefc0445b0feef65b79e |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-381 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-062 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49158 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1327 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01Q23-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0284 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01Q21-0087 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01Q1-38 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 |
| filingDate | 2009-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-07-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6f111358908095b8922ae8c2f3a0757e |
| publicationDate | 2013-07-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | ES-2415879-T3 |
| titleOfInvention | Manufacturing procedure of a three-layer multilayer interconnection device |
| abstract | A method of manufacturing a three-dimensional interconnection device, the device comprising a plurality of interconnection layers, comprising the following steps: - a stage of laminating a printed circuit board (1) comprising a plurality of interconnection layers; - a step of inserting the printed circuit board into a three-dimensional mold; - a step of injecting a molding material into the mold, so that a three-dimensional non-flat structure (2) is formed that includes the printed circuit board; and - a subsequent step of metallizing a portion (3a, 3b, 3c) of the external surface of the three-dimensional structure, so that it is connected with at least one interconnecting layer (4a, 4b) of the printed circuit board. |
| priorityDate | 2008-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID409060395 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID14798 |
Total number of triples: 22.