| abstract |
A circuit board assembly (160) comprising: a circuit board (161) having an outer surface; a plurality of discrete electrical components (146a, 146b, 146c) each independently manufactured from each other, each electrical component (146a, 146b, 146c) being discrete coupled to the outer surface of the circuit board (161); a first protective dielectric layer (150) superimposed on the outer surface and the discrete electrical components (146a, 146b, 146c), completely covering the first discrete protective dielectric layer (150) the electrical components (146a, 146b, 146c); a second dielectric layer (156) superimposed on the first protective dielectric layer (150), the second dielectric layer (156) having a thickness in the range of approximately 5 nm to 200 nm (50 to 2000 angstrom), completely covering the second dielectric layer (156) the discrete electrical components (146a, 146b, 146c); and a coupling agent between the first protective dielectric layer (150) and the second dielectric layer (156). |