| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f75c33ae35e5d1dc4b05e62ec461c17f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41N3-003 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41N1-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41N1-06 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41N1-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41N1-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-04 |
| filingDate |
2007-01-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2013-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_98b90c3ca923787f2da5ce34752d0231
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dd4c2d6dd3caf0ab5b68c8e53f9667b6 |
| publicationDate |
2013-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
ES-2408708-T3 |
| titleOfInvention |
Copper electroplating printing cylinders |
| abstract |
A copper plating bath for depositing a copper layer on a printing cylinder, the copper plating bath comprising: a) a source of copper ions; b) a source of methanesulfonate ions; c) a source of chloride ions; d) an organosulfur compound having the formula RS-R'-SO3 -X+ or X+-O3S-R'-SRS-R'-SO3 -X+, where R is alkyl, hydroxyalkyl or alkyl ether, R' is a group C2-C4 alkyl and X+ is a cation; and e) a polyether compound. |
| priorityDate |
2006-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |