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publicationDate 2012-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber ES-2383507-T3
titleOfInvention Composition of halogen-free and pre-impregnated flame retardant resin, laminated and laminated for printed circuit manufactured from it
abstract A halogen-free flame retardant resin composition calculated according to the parts by weight of organic solids comprising: (A) 40-80 parts by weight of a mixture of a phenoxyphosphazene compound (A1) and a compound containing dihydrobenzoxacin ring (A2), in which the weight ratio between the phenoxyphosphazene compound (A1) and the compound containing dihydrobenzoxacin ring (A2) is between 1:10 and 1: 2; (B) 15-45 parts by weight of one polyepoxy compound; (C) 5-25 parts by weight of a phenolic resin type hardener; and (D) 0.1-1 parts by weight of an imidazole type compound as a curing accelerator.
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