| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_24aca9ded2638ea793d05360dde7a4a0 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L81-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S525-905
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L77-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L67-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L69-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L81-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L59-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-06 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L51-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L71-123 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L81-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L59-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L81-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L77-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L69-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L67-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L51-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L71-12 |
| filingDate |
1989-11-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1995-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5d1a0b72a00968e3a5c4daf53951fc0d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_20925e593cd52b9b533a8431e0743dbd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ba999faa8ce6ba4a995379d13590bdbc |
| publicationDate |
1995-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
ES-2071664-T3 |
| titleOfInvention |
THERMOPLASTIC RESIN COMPOSITION. |
| abstract |
DISCOVERED HERE IS A COMPOSITION OF THERMOPLASTIC RESIN WHICH INCLUDES: (A) POLYPHENYLENE ETHER OR A COMPOSITION CONTAINING POLYPHYLENE ETHER POLYPHYLENE POLYMER, GRAFTED WITH A SINGLE MONO MONETHERONE. BASE STYRENE AND A COPOLYMERIZABLE MONOMER WITH THE BASE STYRENE MONOMER, OR (II) A COMPOSITION CONTAINING SUCH A MODIFIED PROPYLENE POLYMER AND A PROPYLENE POLYMER, (C) A SELECTED SUBSTANCE IN GOLD COMPONENTS; (D) A STYRENE RESIN HAVING A MELTING RATE OF 8 OR HIGHER (AT 250 LOW MOLECULAR CARBIDE, AND (F) LEAD FREE OIL AND / OR LIQUID PARAFFIN. THIS COMPOSITION OF THERMOPLASTIC RESIN DOES NOT ONLY GOOD MOLDEABILITY GOOD BALANCE OF PHYSICAL PROPERTIES AND HEAT RESISTANCE, AND CAN BE EASILY PROCESSED IN MOLDED ITEMS HAVING EXCELLENT PHYSICAL PROPERTIES. |
| priorityDate |
1988-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |