| abstract |
A resin composition and a use thereof is provided. The resin composition includes, in parts by weight, 100 parts of an alkali-soluble resin, 5-30 parts of acrylate monomers, 0.1-10 parts of photoinitiator, 10-30 parts of a first epoxy resin and 0-15 parts of a second epoxy resin. The first epoxy resin is a low-dielectric epoxy resin with a dielectric constant of <3.5, and the second epoxy resin is different from the first epoxy resin. With the addition of the low epoxy resin with the dielectric constant of < 3.5, and by adjusting the ratio of the components, the resin composition significantly reduces the dielectric constant and dielectric loss, the dielectric constant is reduced to 3.0 or less, and the dielectric loss is reduced to 0.008 or less. In addition, the resin composition also provides excellent heat resistance, resolution, and a reduced resilience, and also provides relatively improved flexibility and bending resistance. At the same time, the resin composition is a photosensitive resin composition and allows an image transfer by means of photographic development. |