| abstract |
Provided is a polyorganosiloxane with an epoxy group, a curable resin composition, and a cured product with high compatibility with an initiator and another resin, low viscosity, a high curing rate, and high adhesiveness and impact resistance. A polyorganosiloxane with an epoxy group comprising an M unit (R<sup>1</sup>R<sup>2</sup>R<sup>3</sup>SiO<sub>1/2</sub>), a D unit (R<sup>4</sup>R<sup>5</sup>O<sub>2/2</sub>), and a Q unit (SiO<sub>4/2</sub>), a T unit (R<sup>6</sup>SiO<sub>3/2</sub>) content being 80% or less by mole of total silicon. The epoxy group has a group represented by the following formula (2) and a group represented by the following formula (3). In the formula (2), R<sup>8</sup> denotes an optionally substituted divalent organic group having 1 to 20 carbon atoms. g is 0 or 1. In the formula (3), R<sup>9</sup> denotes an optionally substituted divalent organic group having 1 to 20 carbon atoms. h is 0 or 1, 0 ≤ i ≤ 8, and 0 < j ≤ 8. |