| abstract |
The present invention relates to a lead-free water barrier suited for dynamical submarine high voltage power cables wherein the water barrier comprises a laminate structure, and wherein the laminate structure comprises a metal foil having a lower and an upper surface area, a first layer of a thermoplastic semiconducting polymer laid onto the first adhesive layer, and a second layer of a thermoplastic semiconducting polymer laid onto the second adhesive layer, and wherein the laminate structure is thermally joined by a heat treatment. |