| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36f8253f3d0d59bcd9259217d4385d10 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N27-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y15-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01C17-003
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N27-125
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N27-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N27-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N27-128
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N27-129
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N27-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01C17-06506 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N27-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N27-12 |
| filingDate |
2020-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_187caf6988fa1c81649a5641894b7b6e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cfb4830594846246d9c1219bcd12946c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b8d37149e1eac47026a509f951181ad2 |
| publicationDate |
2022-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-4016065-A1 |
| titleOfInvention |
Method for manufacturing an electronic component |
| abstract |
Disclosed is a method for manufacturing an electronic component (1), wherein the method comprises the steps of: nproviding a substrate (2) and a functional layer (3) supported by the substrate; nforming a structured protection layer (4) on a side of the substrate, to which the functional layer is attached to, wherein the structured protection layer has one or more recesses (5) so that one or more portions (6) of the functional layer are exposed; napplying a dispersion (7) comprising a solvent and electrically conductive components to the exposed portions of the functional layer so that the recesses are at least partially filled with the dispersion; ndrying the dispersion in order to create an electrically conductive layer (8); nremoving the structured protection layer. |
| priorityDate |
2020-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |