| abstract |
The invention relates to a radiation-curable resin composition comprising 0 to 30 wt.% of one or more oligomers, 15 to 80 wt.% of one or more monomers, 10 to 80 wt.% of a filler mixture, and 0.1 to 5 wt.% of one or more photoinitiators, the filler mixture comprising the following: 39.9 to 90 wt.% of first particles having a grain size d50 vol of 3 to 20 µm, 9.9 to 60 wt.% of second particles having a grain size d50 vol of 0.5 to 1 µm, and 0.1 to 5 wt.% of nanoparticles having a BET in the range of 10 to 100 m²/g. |