| abstract |
The aim of the invention is to devise a pressure-sensitive adhesive compound which has a wide spectrum of bonding performance, can be efficiently produced and in particular has an excellent thermal conductivity. The compound should possibly also have electrically insulating properties. For this purpose, a pressure-sensitive adhesive compounds contains a. at least one poly(meth)acrylate; and b. at least 40 vol.%, relative to the total volume of the pressure-sensitive adhesive compound, of a mixture of at least two fillers, and is characterized in that the mixture of at least two fillers includes at least one filler Fisph that consists of substantially spherical particles. The invention also relates to the use of a pressure-sensitive adhesive compound according to the invention for conducting heat. |