| abstract |
The present invention relates to a thermosetting resin composition, in particular for the use as adhesive, obtained or obtainable from the reaction of at least: a polycarbodiimide (i), wherein the number of carbodiimide groups per molecule is in the range of from 1 to 10; a mixture of crystalline and amorphous polyols (ii), wherein the molar ratio of carbodiimide groups in the polycarbodiimide according to (i) to hydroxyl groups in the mixture according to (ii) is in the range of from 1 :2 to 2:1 and wherein at least 25 weight-% of the mixture according to (ii) consists of at least one crystalline polyesterol, based on the overall weight of the mixture being 100 weight-%. The invention further relates to the use of said thermosetting resin composition as adhesive, as well as to processes for preparation of adhesives, an element comprising an adhesive layer on at least one substrate and to an adhesive film, obtained or obtainable from one of the processes. |