| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_af96413821843e2b681f83ae466fceda |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-2227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2201-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-005 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-3417
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-3437
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K9-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-3465
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-04 |
| filingDate |
2020-10-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d9b6dc00e0fe78de69a1c4009148f383
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c3b5df555c7c6d6c81b1ff803107c6fe
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_abe801772339a89e1f070248104d7797 |
| publicationDate |
2021-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-3929240-A1 |
| titleOfInvention |
Heat resistant silicone resin composition and heat resistant silicone resin composite material |
| abstract |
A heat-resistant silicone resin composition contains a silicone resin and a heat resistance improver. The heat resistance improver is an organic polycyclic aromatic compound having one or more secondary amino groups and one or more ketone groups in a ring structure. The organic polycyclic aromatic compound may be, e.g., quinacridone (P.V. 19) represented by the following Chemical Formula 1. A silicone resin composite material of the present invention includes the heat-resistant silicone resin composition and at least one filler selected from the group consisting of an inorganic filler and an organic filler. The at least one filler is contained in the heat-resistant silicone resin composition. Thus, the silicone resin composition and the silicone resin composite material have high heat resistance. |
| priorityDate |
2020-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |