| abstract |
The present disclosure relates to a camera package, a method for manufacturing a camera package, and an electronic device with which it is possible to reduce manufacturing cost for lens formation. n The camera package according to the present disclosure includes: a solid-state imaging element; and a lens formed above a transparent substrate that protects the solid-state imaging element. A lens formation region in which the lens is formed above the transparent substrate and a lens free region around the lens formation region differ in contact angle. The present disclosure can be applied to, for example, a camera package in which a lens is disposed above a solid-state imaging element, or the like. |