| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-2248
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-2251
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1815
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16227 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L39-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3121
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-688
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L39-04 |
| filingDate |
2019-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fe870602bac5cbc129b7a142f242310c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_28f62f9d9bdf74baf3329576968981f4 |
| publicationDate |
2021-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-3901214-A1 |
| titleOfInvention |
Thermosetting resin composition for lds and method for producing semiconductor device |
| abstract |
A thermosetting resin composition for laser direct structuring (LDS) which is used for LDS includes the following components: (A) a thermosetting resin; (B) an inorganic filler; (C) a non-conductive metal compound that forms a metal nucleus upon irradiation with active energy rays; and (D) a coupling agent, in which the component (A) contains one or more selected from the group consisting of an epoxy resin and a bismaleimide resin, and at least one of the following conditions is satisfied.Condition 1: a ratio of particles having a particle size equal to or more than 1 µm and equal to or less than 20 µm in the component (B) is equal to or more than 40% by volume and equal to or less than 95% by volume with respect to a total volume of the component (B), andCondition 2: an angle of fall of the thermosetting resin composition for LDS is equal to or less than 35°. |
| priorityDate |
2018-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |