| abstract |
A method for partially filling a space between two superimposed structures in a semiconductor device under construction, comprising the steps of:a. Providing the two superimposed structures having said space therebetween,b. Entirely filling said space with a thermoplastic material,c. Removing a first portion of the thermoplastic material present in the space, the first portion comprising at least part of a top surface of the thermoplastic material, thereby leaving in said space a remaining thermoplastic material having a height, andd. heating up the remaining photosensitive thermoplastic material so as to reduce its height. |