| abstract |
This addition curing silicone composition in which an organopolysiloxane containing an aliphatic unsaturated hydrocarbon group, a heat-conductive filler, an organohydrodiene polysiloxane having a specific structure, an organic peroxide, a hydrolysable organosilane compound, a platinum group metal catalyst, and, as needed, a silicone resin having an aliphatic unsaturated hydrocarbon group are blended in specific amounts can provide a silicone thermal grease that has high thermal conductivity in comparison with the conventional silicone thermal grease, and that has good adhesion to various adherends. |