Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b8dd69196d51115a7ef51556f2800eb5 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06T2207-30148 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06T2207-30141 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N21-8851 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06T7-0004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-308 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06T7-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06F30-398 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06T7-001 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06T7-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06T3-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F1-84 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06T7-75 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06T7-136 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-308 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06T7-00 |
filingDate |
2019-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7106bfed3ba5af3ff8593a5ef0eb6a13 |
publicationDate |
2021-08-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
EP-3864423-A1 |
titleOfInvention |
Compensating for reference misaligment during inspection of parts |
abstract |
Methods and apparatus for inspection of electronic parts such as semiconductor wafers, high-density circuit boards, multi-layer substrates, chrome on glass masks, and other fine line products which compensates for reference misalignment. Conductor linewidth and space measurements are performed along the entire length of every conductor to sub-camera pixel, sub-micron accuracy in real time as the 5 part is scanned. Billions of metrology measurements are also performed in real time to sub-micron accuracy. A self-learning automated method to extract measurement values from Computer Aided Design (CAD) files is described. This method automatically determines locations to perform these billons of operations within defined allowed manufacturing tolerances. |
priorityDate |
2018-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |