http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3829274-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fd446fb0d73aa96d044fea2eaa3c8ebc |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0999 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09909 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B33Y80-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1476 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09036 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0126 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-186 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-465 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-18 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 2020-11-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8ff18e8a4abc56c9745f01e65bc6dbe6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_72d378fe0dbbd684a01d5cb9edda7fe4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d40d4edbaa4ef3105d86add34b524e68 |
| publicationDate | 2021-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | EP-3829274-A1 |
| titleOfInvention | Method for the production of electronic components |
| abstract | The invention relates to a method for the production of complete electronic components (64) with electronic and / or non-electronic components (74), which are built in a housing ( 60), whereby the following procedural steps are carried out: a) Printing an outer contour (48) of a 2D structure (50), b) Networking 52 of the outer contour (48) of the 2D structure (50), c) by means of a UV light source (34), d) filling 54 of the outer contour (48) in such a way that individual layers (80) are produced in the desired geometry with recesses for at least one cavity (70, 72, 100, 114), e) renewed crosslinking (52) of the closed 2D structure (56) by means of the UV light source (34), f) generating a stack structure (58) by repeating steps a) to e), g) Filling adhesive into the at least one cavity (70, 72, 100, 114) in a defined amount, h 1 ) placing at least one electronic or non-electronic component (74) in the at least one cavity (70, 72) and creating a closed individual layer (80) with an embedded component (74) or h 2 ) Production of 2D conductor track structures (88) or 3D conductor track structures (106) in cavities (100, 114), in particular channels or on open areas (92) by dispensing a conductive adhesive (102) into the cavities (100, 100) designed as channels. 114) or on the open spaces (92), i) renewed crosslinking (52) of the closed 2D structure (56), j) repeating method steps a) to e) until a complete stack structure (58) has been built in the Z direction (30) and k) curing of the resulting stack structure (58) of the complete electronic component (64) made of 2D structures (50) in the Z direction (30). |
| priorityDate | 2019-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 36.