| abstract |
Provided is an encapsulating resin composition that is used for collectively encapsulating a circuit board (10) and at least a part of a connector portion (20), in which the encapsulating resin composition contains a curing accelerator, the connector portion (20) includes a terminal (21) that electrically connects the circuit board (10) with the external device, and a housing (22) that is disposed on an outer periphery of the terminal (21) and is encapsulated by the encapsulating resin composition, the housing (22) contains a thermoplastic resin, and in a differential scanning calorimetry (DSC) curve of the encapsulating resin composition obtained in a case where a temperature is increased from 30°C to 200°C under conditions of a temperature increase rate of 10°C/min using a DSC meter, a maximum heat release peak temperature is equal to or higher than 100°C and equal to or lower than 163°C, and a half-value width of a maximum heat release peak is equal to or higher than 5°C and equal to or lower than 25°C. |