| abstract |
This photocurable resin composition contains a polymer cross-linked material (A) and a polymeric material (B), wherein the polymer cross-linked material (A) contains urethane(meth)acrylate, and the polymeric material (B) contains a polyurethane resin that includes a structure derived from polycarbonate polyols and that does not have an acrylic group. This photocurable resin composition has excellent high-temperature adhesion. The urethane(meth)acrylate in the polymer cross-linked material (A) preferably includes a structure derived from polycarbonate polyols. |