| abstract |
The compositions of the present disclosure polish surfaces or substrates that at least partially include ruthenium. The composition includes a synergistic combination of ammonia and oxygenated halogen compound. The composition may further include abrasive and acid(s). A polishing composition for use on ruthenium materials may include ammonia, present in an amount of 0.01 wt% to 10 wt%, based on the total weight of the composition; hydrogen periodate, present in an amount of 0.01 wt% to 10 wt%, based on the total weight of the composition; silica, present in an amount of 0.01 wt% to 12 wt%, based on the total weight of the composition; and organic sulfonic acid, present in an amount of 0.01 wt% to 10 wt%, based on the total weight of the composition, wherein the pH of the composition is between 6 and 8. |