| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G2250-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-0025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-5033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-226
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-245 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-04 |
| filingDate |
2018-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0f26648d5d25b55ff87a69604f025f8b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ec0344b8d6cff1ab55895e75fcec4f35
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1f80c98448afd64eca54740862dc59bf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bf273a0369d3a7f125c4336f041646ff
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c1f9393170945a4f5d8f62848a6272a7 |
| publicationDate |
2020-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-3757148-A1 |
| titleOfInvention |
Epoxy resins, epoxy resin composition, cured epoxy resin and production method therefor, composite material, insulating member, electronic appliance, structural material, and moving object |
| abstract |
(1) An epoxy resin, which is configured to form, in a cured product of the epoxy resin, a phase-separated structure that is formed from at least two phases, wherein at least one phase of the at least two phases includes a liquid crystal structure and(2) An epoxy resin, which is configured to form a phase-separated structure in a cured product, the cured product being obtained by curing the epoxy resin by increasing a temperature of the epoxy resin from an ambient temperature to a curing temperature at a rate of not greater than 20°C/minute. |
| priorityDate |
2018-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |