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filingDate 2019-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4efd1acdb67be28b2ebb76cdfb385b79
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publicationDate 2020-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-3743940-A1
titleOfInvention Method for producing a soulder bump on a substrate surface
abstract The invention relates to a serigraphy method for producing a soulder bump (50) on the front surface of a substrate (10), the method comprising the following steps: (a) forming a film (30) on the front surface; (b) forming an opening in the film (30); (c) filling the opening with a souldering material; (d) removing the film (30). The method is characterised in that step (a) is preceded by the formation of an intermediate layer (20) between the film and the front surface, the intermediate layer (20) being adapted to exhibit a force of adherence at one and/or the other interface formed with the first front surface and the film lower than the force of adherence that can be formed between the film and the first front surface. Figure 1e.
priorityDate 2018-03-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 41.