| abstract |
This disclosure provides a thermosetting resin composition, a prepreg, a laminate, and a printed circuit board. The thermosetting resin composition comprises: a thermosetting polyphenylene ether resin; an unsaturated polyolefin resin; a curing agent; and hollow borosilicate microspheres with surfaces treated with a bromine-containing silane coupling agent, wherein a laminate produced from the thermosetting resin composition may satisfy the requirements for overall properties such as low dielectric constant, low dielectric loss, low water absorption rate, high peeling strength, and the like by a high-frequency electronic circuit substrate. |