| abstract |
The invention relates to a chemical mechanical polishing composition for polishing a substrate having a tungsten layer comprising a water-based liquid carrier, abrasive particles dispersed in the liquid carrier, an accelerator containing iron, and a cationic polymer having an amino acid monomer. The invention also relates to a method for the chemical-mechanical polishing of a substrate comprising a tungsten layer, comprising contacting the substrate with the polishing composition described above, to move the polishing composition relative to the substrate. and abrading the substrate to remove a portion of the tungsten from the substrate and thereby polishing the substrate. |