| abstract |
There is disclosed a phenol resin foam which contains a phenol resin and a foaming agent comprising at least either one of a chlorinated hydrofluoroolefin or a non-chlorinated hydrofluoroolefin. With respect to the phenol resin foam, the density is 10 kg/m<sup>3</sup>or more and 150 kg/m<sup>3</sup>or less, the thermal conductivity under a 10°C environment is 0.0175 W/m·k or less, the thermal conductivity under a 23°C environment is 0.0185 W/m·k or less, and the oxygen index is 28% by volume or more. |