| abstract |
- The connection process between at least two elements (E1, E2) corresponding to a printed circuit (4) and to an electronic component (5), comprises a step of forming a plurality of stacks (2) of bosses ( 3) of the stud type, the stacks (2) of bosses (3) being formed on one face (10) of a first (E1) of said elements (E1, E2), said stacks (2) of bosses (3) comprising each the same given number of bosses (3), said method also comprising a step of depositing a brazing product (7) on this first element (E1) provided with stacks (2) of bosses (3), a step of arrangement of the second (E2) of said elements (E1, E2) on said first element (E1), and a step of remelting the assembly thus formed to obtain an electronic device (1). This process allows for precise and flexible elevation for surface mounted electronic components. |