Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3146812a1c085624a65b46fae27d81d3 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-6677 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-97 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15192 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1815 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3025 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-322 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-143 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3128 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-552 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41M5-0047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-101 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-037 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-52 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-552 |
filingDate |
2018-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dcb56ab60b7d4ab36f8656c0e3fb7a10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b72ac464091e16c127f20639dc26d16a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bee2eecdf757c9f7d8c8ac6278e8ad76 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_14bd734c9919471cfe9e323541e9a233 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_29c25d292a091f9a610b639519bf5ec2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a0e0199fcd2dbcc5852c74d6a2190625 |
publicationDate |
2020-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
EP-3648161-A1 |
titleOfInvention |
Method of manufacturing an electromagnetic interference shielding layer |
abstract |
The present invention relates to a method of manufacturing a semiconductor package, which is at least in part covered by an electromagnetic interference shielding layer, comprising at least these steps: i. Providing the semiconductor package and an ink composition; wherein the ink composition comprises at least these constituents: a) A compound comprising at least one metal precursor; b) At least one organic compound; and ii. Applying at least a part of the ink composition onto the semiconductor package, wherein a precursor layer is formed; iii. Treating the precursor layer with an irradiation of a peak wavelength in the range from 100 nm to 1 mm, and to a semiconductor package comprising an electromagnetic interference shielding layer comprising at least one metal, wherein the semiconductor package is obtainable by the aforementioned method. The present invention relates also to a semiconductor package comprising a electromagnetic interference shielding layer, wherein the specific conductance of the first layer of electromagnetic interference shielding material is in the range from 5 to 90 % of bulk metal; and wherein the thickness of the first layer of electromagnetic interference shielding material is in the range from 5 nm to 5 µm. The present invention relates further to some uses of an ink composition. |
priorityDate |
2018-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |