| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2a819eda0adf22936a52362eeebb9fb4 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2021-6024
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B2562-164
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0313
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B2562-0271
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05551
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09509
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B2562-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09563
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05555
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09263
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B2562-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B2562-0219
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05582
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81192
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0569
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B2562-0261
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-03003
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0133
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81815
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05647
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y10-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1132
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y5-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5386
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5384
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5385
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0283
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B5-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B5-282
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B5-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B5-6824
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-162
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B5-296
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0035
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-284
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-486
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B5-6823
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B5-6814
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B5-291 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61B5-296
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B82Y5-00 |
| filingDate |
2018-04-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_67aceb140da536b73f57e2a31039abe0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_30e87f0bc8c3a83b99aab5aa64322733 |
| publicationDate |
2020-02-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-3606417-A1 |
| titleOfInvention |
Three-dimensional integrated stretchable electronics |
| abstract |
A method of fabricating a stretchable and flexible electronic device includes forming each of the functional layers is by: (i) forming on an elastomer substrate a conductive interconnect pattern having islands interconnected by bridges; (ii) applying a conductive paste to the islands; (iii) positioning at least one functional electronic component on each island; and (iv) applying heat to cause the conductive paste to reflow. An elastomer encapsulant is formed over the functional electronic components and the conductive interconnect pattern on each of the functional layers. The elastomer encapsulant has a Young's modulus equal to or less than that of the substrate. The encapsulant includes a pigment to increase absorption of laser light. At least one via is laser ablated, which provides electrical connection to any two functional layers. The via is filled with solder paste to create a bond and electrical connection between the functional layers. |
| priorityDate |
2017-04-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |