| abstract |
This heat dissipation circuit board (10) includes a metal substrate (11), an insulating layer (12) provided on at least one of the surfaces of the metal substrate (11), and a circuit layer (13) provided on the opposite surface to the metal substrate (11) of the insulating layer (12). The insulating layer (12) contains a resin that is selected from polyimide, polyamide-imide, and the mixture thereof, and ceramic particles having a specific surface area of 10 m<sup>2</sup>/g or more. The ceramic particles form agglomerates, and the amount of the ceramic particles is in the range of 5 vol% or more and 60 vol% or less. |