| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4d72711e97d894c55af805c9de2053ab |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-405
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1675
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-40 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-40 |
| filingDate |
2019-06-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_15424e8a9ac2ee1be72291c28333dbad
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5891f8403bd0210e9cc46cf4ebc11840
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9fb309ece3adc2e92a668e2df4d3900f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50f02d3e2c2c1e875ecfc11f94eb80b3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_adc3c98a2e18af37f47f0bdb0e38dc27
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e206ff0adccd50585d2ae03fbabb0358 |
| publicationDate |
2019-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-3581677-A1 |
| titleOfInvention |
Electroless copper plating compositions and methods for electroless plating copper on substrates |
| abstract |
Stable electroless copper plating baths include pyridinium compounds to improve rate of copper deposition on substrates. The copper from the electroless plating baths can be plated at low temperatures and at high plating rates. |
| priorityDate |
2018-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |