| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_69bddb4c84704857f70d926c31a6e1a2 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-365 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-37276
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-3758
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-3756
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-375 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61N1-375 |
| filingDate |
2018-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5a74fe6e04bc9de27cd4a05f51950ee6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0a871a2b43b5630d9730cb23a00ed2f9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bffa98211f1402cdc0f0109e7ba1da61
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cb21bfdd432cff79a075b016195a9fc0 |
| publicationDate |
2019-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-3573709-A1 |
| titleOfInvention |
Leadless device with overmolded components |
| abstract |
An electronics module for use in an Implantable Medical Device (IMD) may include a plurality of electrical components connected to form a circuit that includes a terminal and a potting material that supports the plurality of electrical components. The plurality of electrical components and the potting material together form a circuit sub-module in which the terminal is accessible from outside of the circuit sub-module. A metallic layer that conforms to an outer surface of the circuit sub-module is provided thereon such that the terminal is accessible from outside of the metallic layer. |
| priorityDate |
2017-01-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |