| abstract |
This thermally-conductive silicone composition comprises:(A) an organopolysiloxane having two or more alkenyl groups per molecule, and having a kinetic viscosity of 10-100,000 mm/s at 25°C,(B) a hydrolysable methyl polysiloxane which is represented by formula (1)(Rrepresents an alkyl group, and a is 5-100) and of which one end is trifunctional,(C) a thermally-conductive filler having a thermal conductivity of 10 W/m·°C or more,(D) an organohydrogen polysiloxane having two or more Si-H groups per molecule,(E) a catalyst selected from the group consisting of platinum and platinum compounds, and(F) a benzotriazole derivative represented by formula (2)(Rrepresents H or a monovalent hydrocarbon group, and Rrepresents a monovalent organic group). The composition can inhibit the decrease of the curing speed. A cured product of the composition has a small hardness increase when being aged at a high temperature, and has a small heat resistance increase after undergoing a heat cycle test. |