| abstract |
Provided is a thermal conductive silicone composition containing:(A) an organopolysiloxane having a kinetic viscosity of 10 to 100,000 mm/s at 25°C, and represented by the following average composition formula (1) RSiO (1)wherein Rrepresents a hydrogen atom or a monovalent hydrocarbon group, and a represents a number satisfying 1.8 ≤a≤2.2;(B) silver nanoparticles having an average particle size of 3 to 600 nm;(C) a thermal conductive filler other than the component (B), having an average particle size of 0.7 to 100 µm and a thermal conductivity of 10 W/m°C or higher; and(D) a catalyst selected from the group consisting of a platinum based catalyst, an organic peroxide and a catalyst for condensation reaction. |