abstract |
A thermoconductive silicone composition which has (A) an organopolysiloxane as a base polymer and includes (B) a thermoconductive filler, wherein the thermoconductive filler is 60-85 vol% of the thermoconductive silicone composition, and 40-60 vol% of the thermoconductive filler is aluminum nitride having an average particle diameter of at least 50 µm. |