abstract |
A photosensitive resin composition comprising a dual end alicyclic epoxy-modified silicone resin having formula (Al) and a photoacid generator is provided. In formula (Al), Rto Rare a C-Cmonovalent hydrocarbon group and n is an integer of 1-600. The composition enables pattern formation using radiation of widely varying wavelength, and the patterned film has high transparency, light resistance, and heat resistance. |